Process (工序) |
Sub-Process (子工序) |
Main equipment (设备名称) |
Inner layer (内层干膜) |
Pre-treatment (前处理) |
Chemical clean(化学清洗线) |
Film laminatation (贴膜) |
Wet film printing (湿膜涂敷) |
Auto. Dry film laminate(自动贴膜机) |
Exposure(曝光) |
Auto. Exposure machine(自动曝光机) |
Inner layer AOI (内层AOI) |
Inner layer AOI (内层AOI) |
AOI machine(AOI机) |
Lamination(压合) |
Alignment(铆合) |
Riveting / weld / pinning system(铆接/焊接/钉扎系统) |
X-RAY Machine(X光检查机) |
Pressing(压合) |
Press machine(热油压板机) |
Post press( 后压) |
X-RAY target hole machine(X-Ray)( 钻靶机) |
Drilling (钻孔) |
Drilling(钻孔) |
Mechanical drilling machines(机械钻孔机) |
PTH / Panel plating |
Panel plating (板电镀) |
PTH line (垂直沉铜线) |
VCP line(垂直连续电镀线) |
Panel plating line(板电线) |
Outer layer (外层干膜) |
Film laminate (贴膜) |
Auto. Film laminate(自动贴膜机) |
Exposure(曝光) |
Auto. Exposure machine(自动曝光机) |
Outer layer AOI (外层干膜) |
AOI machine(AOI机) |
Pattern Plating (图电) |
Pattern Plating (图电) |
Pattern Plating line(图电) |
Soldermask (绿油) |
Pre-treatment (前处理) |
Micro etching (超粗化) |
Exposure(曝光) |
Auto. Exposure machine(自动曝光机) |
Legend(字符) |
Legend(字符) |
Legend ink jet printer(字符打印机) |
Routing (锣板) |
Routing (锣板) |
Auto. score machine(自动V-cut机) |
E-test(电测) |
E-test(电测) |
Universal test machines (通用测试机) |
Flying probe test machines (飞针测试机) |
Physical Lab
(物理实验室) |
Physical Lab
(物理实验室) |
Temp/Humidity Chamber (高低温测试仪) |
Microscope(显微镜) |
Thermal stress test
热应力测试(有铅 / 无铅锡炉) |
XRF Machine (金属厚度光谱测试仪) |
Impedance tester (阻抗测试仪) |