Shenzhen Honghuaxin Electronics Co., Ltd.
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Technology

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Process parameters
    
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Due time
    
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Equipment Exhibition

Number

Item

Processing capacity

1

Production layer

1-40 Floor

2

Maximum processing size

620mm*1200mm

3 Board thickness

2 Floor

0.2mm-6.0mm

4 Floor

0.4mm-6.0mm

6 Floor

0.8mm-6.0mm

8 Floor

1.0mm-6.0mm

10 Floor

1.2mm-6.0mm

12 Floor

1.4mm-6.0mm

14 Floor

1.5mm-6.0mm

16 Floor

1.6mm-6.0mm

18 Floor

2.2mm-6.0mm

20 Floor

2.4mm-6.0mm

4

Minimum line width

2.5mil

5

Minimum line distance

2.5mil

6

Minimum aperture size

Machine through hole 0.15mm
Laser hole 0.075mm

7

Metallized aperture tolerance

+/-0.075mm

8

Non-metalized aperture tolerance

+/-0.05mm

9

Overall tolerance

+/-0.1mm

10

Hole position tolerance

+/-0.05mm

11

The smallest green oil bridge

0.075mm

12

Hole wall copper thickness

10um-50um

13 Copper thickness Inner layer 0.5oz-5oz
Outer layer 0.5oz-13oz

14

Surface treatment

There are lead tin spray, lead-free tin spray, organic solder mask, nickel gold, silver immersion, tin tin, electro nickel gold

15

Insulation resistance

1*1012Ω

16

Aspect ratio

Through hole: 13:1

Blind hole:2:1

17

Warpage

≤0.7%

18

Impedance control tolerance

+/-10%

19

Flame retardant

94V-0

20

Sheet

FR4, CEM3, high TG, Rogers, Teflon, PTFE, Arlon, Taconic, metal base, etc.

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Company:Shenzhen Honghuaxin Electronics Co., Ltd.
Address:206, Building C, Huachuangda Cultural Technology Industrial Park, 49 District, Baoan, Shenzhen
Factory: Building 8, Xinda Science and Technology Park, Xinfeng County Industrial Park, Ganzhou City, Jiangxi Province
Tel:13714468531     Email:hhx@szhhxdz.com
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