Number
|
Item
|
Processing capacity
|
1
|
Production layer
|
1-40 Floor
|
2
|
Maximum processing size
|
620mm*1200mm
|
3 |
Board thickness |
2 Floor
|
0.2mm-6.0mm
|
4 Floor
|
0.4mm-6.0mm
|
6 Floor
|
0.8mm-6.0mm
|
8 Floor
|
1.0mm-6.0mm
|
10 Floor
|
1.2mm-6.0mm
|
12 Floor
|
1.4mm-6.0mm
|
14 Floor
|
1.5mm-6.0mm
|
16 Floor
|
1.6mm-6.0mm
|
18 Floor
|
2.2mm-6.0mm
|
20 Floor
|
2.4mm-6.0mm
|
4
|
Minimum line width
|
2.5mil
|
5
|
Minimum line distance
|
2.5mil
|
6 |
Minimum aperture size
|
Machine through hole |
0.15mm |
Laser hole |
0.075mm |
7
|
Metallized aperture tolerance
|
+/-0.075mm
|
8
|
Non-metalized aperture tolerance
|
+/-0.05mm
|
9
|
Overall tolerance
|
+/-0.1mm
|
10
|
Hole position tolerance
|
+/-0.05mm
|
11
|
The smallest green oil bridge
|
0.075mm
|
12
|
Hole wall copper thickness
|
10um-50um
|
13 |
Copper thickness |
Inner layer |
0.5oz-5oz |
Outer layer |
0.5oz-13oz |
14
|
Surface treatment
|
There are lead tin spray, lead-free tin spray, organic solder mask, nickel gold, silver immersion, tin tin, electro nickel gold
|
15
|
Insulation resistance
|
1*1012Ω
|
16
|
Aspect ratio
|
Through hole: 13:1
Blind hole:2:1
|
17
|
Warpage
|
≤0.7%
|
18
|
Impedance control tolerance
|
+/-10%
|
19
|
Flame retardant
|
94V-0
|
20
|
Sheet
|
FR4, CEM3, high TG, Rogers, Teflon, PTFE, Arlon, Taconic, metal base, etc.
|
|
|
|
|